Patent Search Results

OTP Home - external
OTP Home - internal
NIST Home

NIST Office of Technology Partnerships (OTP) Data Services

Contact Us:
Phone: 301-975-3084
Email: otp@nist.gov

Electrical Test Structure And Method For Measuring The Relative Location Of Conducting Features On An Insulating SUBSTRATE
5,602,492 issued 2/11/97
Inventors: Cresswell, Michael W. / Linholm, Loren W. / Allen, Richard A. / Teague, E. Clayton / Penzes, William B.

Full Patent Text Including Drawings

Abstract

A test structure for submicrometer metrology as used in integral circuit manufacture comprises a bridge conductor divided into three segments by pairs of voltage taps. A first segment has no intermediate taps; a second segment has a number of dummy taps intermediate its ends; and a third segment has a single central tap, which may typically be formed in a different step than the remainder of the test structure, intermediate its ends. Preferably, the central tap extends from the same side of the bridge conductor as the taps at the ends of the third segment thereof. In order to evaluate a manufacturing operation, for example, to monitor the accuracy of registration of successive manufacturing steps, test signals are applied successively between the pairs of pads. Comparison of the response of the first and second segments to the test signals allows evaluation of the segment-shortening effect of the taps; comparison of the response of the two portions of the third segment to the test signals allows evaluation of their lengths, and thus of the offset, that is, the accuracy of registration of the step used to form the central tap.
A plurality of substantially identical test structures are formed, for example, on an integrated circuit substrate. Offsets measured with respect to each of the substrates are summed using a least-squares technique, to allow separation of tool-wide misalignment errors and errors in the generation of a particular pattern or similar tool used to form a test structure. By summing the offsets measured with respect to a large number of test structures, random errors due to the presence of dust or other contaminants on the tools are effectively eliminated.

Claims

What is claimed is:
1. An improved test structure for providing a plurality of offset measurements of a first portion of a test structure formed in a first operation with respect to a second portion of said structure formed in a subsequent operation, said test structure comprising:
an elongated bridge conductor with taps at either end for forcing a current therethrough;
a first plurality of taps intersecting said bridge conductor at intervals, said taps being connected to pads for measurement of voltage drops along a first group of nonoverlapping contiguous segments of said bridge conductor defined by the intersection of said taps and said bridge conductor, said first plurality of taps being formed in the same operation as said bridge conductor,
a second plurality of taps formed in a second operation and intersecting said bridge conductor, said second plurality of taps also being connected to pads for measurement of voltage drops along a second group of nonoverlapping contiguous segments of said bridge conductor defined by said second set of taps,
said first and second groups of segments including common portions of said bridge conductor,
wherein in use the respective offsets of the second set of taps with respect to the first set of taps are measured by comparison of voltage drops along said bridge conductor with respect to a plurality of intersections of taps formed in said second processing operation, and whereby errors common to the positions of all of the taps of said second set of taps with respect to said first plurality of taps can be effectively distinguished from errors in the position of one or more of said taps formed in said second operation.
2. The test structure of claim 1, wherein a plurality of identical such test structures are formed at spaced locations on a semiconductor substrate, wherein the same tool is used to form the second plurality of taps at each of said plurality of locations, whereby errors in fabrication of said tool used to form said test structures provides a systematic error distinguishable from errors due to misalignment of tools used in said first and second processing operations.
3. The test structure of claim 1, wherein said taps extend transversely across said bridge conductor for optical measurement of their respective spacing.