72 DPI Image
150 DPI Image
No 300 DPI Version
|
| Title: |
Molecular Electronics |
| Description: |
The flip-chip lamination method creates an ultra-smooth gold surface, which allows the organic molecules to form a thin yet even layer between the gold and silicon.
*EEEL
|
| Subjects (names): |
|
| Topics/Categories: |
Electronics--Molecular Electronics
|
| Type: |
Graphic/scientific data |
| Source: |
National Institute of Standards and Technology |
Credit Line as it should
appear in print: |
Credit: Coll Bau, NIST |
| AV Number: |
09EEEL12 |
| Date Created: |
2009 |
| Date Entered: |
8/25/2009 |
