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Title: Molecular Electronics
Description: The flip-chip lamination method creates an ultra-smooth gold surface, which allows the organic molecules to form a thin yet even layer between the gold and silicon.

EEEL

See also http://www.nist.gov/pml/div683/flipchip_082509.cfm.
Subjects (names):
Topics/Categories: Electronics--Molecular Electronics
Type: Graphic/scientific data
Source: National Institute of Standards and Technology
Credit Line as it should
appear in print:
Credit: Coll Bau, NIST
AV Number: 09EEEL12
Date Created: 2009
Date Entered: 8/25/2009

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